through its Temescal range of products, is a leader in the supply of metallization systems for the processing of gallium arsenide (GaAs), indium phosphide (InP) and other compound semiconductor based wafers. Today the world's most sophisticated optical, wireless and telecommunication systems rely on millions of devices that are made using our deposition systems and components.
The Temescal range of thin film deposition systems and components are known for their reliability. These evaporation systems have documented 90% uptime and, when process controlled, routinely achieve coating uniformities of <2% in the world's leading compound semiconductor device fabs.
Configuration range from simple bell jars to load-locked, automatic cassette-to-cassette loading systems capable of coating wafers ranging in size from 2" to 300mm.
The Temescal range of electron beam guns, power supplies, sweep controllers and substrate fixturing has been optimized for the compound semiconductor, optical and ophthalmic industries.
Our manufactures' patented "Lite-Touch" wafer clips were designed specifically for delicate or thin substrates, such as GaAS or InP. Other innovations include the Pop-Top Source, which provides higher yields and longer uptime than traditional sources, and the CV-6SL e-gun Power Supply that can be controlled via systems GUI, with no hardware controllers required.